Aluminum base copper clad laminate
ALUMINUM BASE COPPER CLAD LAMINATES:
Our main PCB customer: Aspcomp, Eurocir,daeduck,
Support to: Auti LG
Cerificates:
UL approval (E 136069) ISO 2000
Product Type:
HA42 Thermal conductivity ≤ 1.0~2.0W/M.K
Features:
Excellent thermal conductivity
Excellent dimensional stability
Excellent mechanical properties
Excellent electromagnetic shielding
Main Property:
Item | Test Condition | Unit | Spec | Typical Value | |
Thermal Impedance | A | /W | ≤2.0 | - | |
Internal TO-220 | ≤1.0 | 0.90 | |||
Thermal Conducivity | A | W/M.K | - | - | |
ASTM 5470-D | 1.0-2.0 | 1.10 | |||
Peel Strength | A | N/mm | ≥1.40 | 1.84 | |
IPC-TM-650 2.4.8 | 1.73 | ||||
Surface Resistivity | C96/35/90 | MΩ | ≥104 | 10 6 | |
E-24/125 | ≥103 | 10 5 | |||
IPC-TM-650 2.5.17.1 | |||||
Volume Resistivity | C96/35/90 | MΩ-cm | ≥106 | 10 7 | |
E-24/125 | ≥103 | 10 5 | |||
IPC-TM-650 2.5.17.1 | |||||
Elecctrical Strdngth | A | KV/mm | ≥30 | 45 | |
IPC-TM-650 2.5.6.2 | |||||
Dielectric Constant | IPC-TM-650 2.5.5.2 | - | - | 7 | |
Arc Resistance | D48/50+D0.5/23 | S | ≥60 | 120 | |
IPC-TM-650 2.5.1 | |||||
Flammability | UL94 |
| V-0 | V-0 | |
IPC-TM-650 2.3.10 | |||||
Tg | DSC |
| 135±5 | 135 | |
IPC-TM-650 2.4.25 | |||||
Water Absorption | D-24/23 | % | ≤0.5 | 0.18 | |
IPC-TM-650 2.6.2.1 | |||||
CTI | A | - | ≥175 | 200 | |
IEC-60112 |
Application:
LED Lighting circuit
Power supply
Hybrid integrated circuits
Solid State Relays
Specification:
Aluminum Substrate Thickness: 1.0mm 1.2mm 1.5mm 2.0mm
Copper Foil: 18um 35um 70um 105um
Standard Size: 500X600mm 500X1200mm 600X1200mm 1100X1200mm